Process Engineer – THT

About the role

We are seeking a Process Engineer specialized in Through‑Hole Technology (THT) to lead and optimise our wave, selective and manual soldering operations in a high‑reliability electronics environment.

Key responsibilities

• Lead optimisation of wave soldering profiles, including flux application, pre‑heat configuration, dwell time and conveyor speed.
• Own selective soldering programming and nozzle optimisation.
• Standardise manual soldering operations and manage operator certification programmes.
• Reduce defects such as solder bridges, insufficient fill, icicles, solder skips and blow holes.
• Perform root‑cause analysis using cross‑sections, microanalysis and solder joint inspection techniques.
• Develop and maintain work instructions and training materials aligned with IPC standards.
• Drive CAPA implementation and continuous improvement projects.
• Support tooling, fixture design and automation upgrades.

Required profile

• Bachelor’s degree in Electrical, Electronics, Industrial or Mechanical Engineering.
• Minimum 8 years of THT process engineering experience in electronics manufacturing.
• Advanced knowledge of IPC‑A‑610 and J‑STD‑001 standards.
• Strong understanding of solder alloys (SnAgCu, SnPb), flux systems and thermal management.
• Experience in automotive, aerospace or medical electronics preferred.
• Proficient command of English.

Required skills

• Wave soldering profile optimisation
• Selective soldering programming and nozzle design
• Manual soldering standardisation and operator certification
• IPC‑A‑610 and J‑STD‑001 compliance
• Solder alloy knowledge (SnAgCu, SnPb)
• Flux chemistry and thermal dynamics
• Root‑cause analysis (cross‑section, microanalysis)
• CAPA implementation
• Tooling, fixture design and automation upgrades