Senior Memory CAD Engineer – Guadalajara

About the role

Micron Technology is seeking a Senior Memory CAD Engineer to join its Guadalajara Design Center. The role focuses on supporting and advancing CAD tools and flows for high‑bandwidth memory (HBM) and other advanced memory technologies.

Key responsibilities

• Provide day‑to‑day support for CAD tools, design flows, and related collateral used by HBM design teams.
• Collaborate with HBM design, layout, and verification methodology groups to propose and co‑develop advanced capabilities and best practices.
• Support all aspects of mixed‑signal, transistor‑level custom IC design, including logical design, custom layout, parameterized cells, automated place‑and‑route, physical verification, ERC, layout parasitic extraction, netlisting, digital and analog simulation, timing and power analysis, reliability analysis, tape‑out, and mask generation.

Required profile

• Bachelor’s (preferably Master’s or PhD) in Computer Engineering, Computer Science, or Electrical Engineering.
• 5+ years of hands‑on CAD or design experience in mixed‑signal, custom IC design flows.
• Proven experience working in technical IC design or CAD teams distributed globally.
• Familiarity with memory design technologies such as DDR3/4/5, LPDDR3/4/5, HBM, and NAND.

Required skills

• CAD tools for custom IC design.
• Mixed‑signal IC design, custom layout, parameterized cells.
• Place‑and‑route automation, physical verification, ERC, Layout Parasitic Extraction.
• Digital and analog circuit simulation, timing and power analysis, reliability simulation.
• Tape‑out and mask generation processes.
• Memory design expertise (DDR, LPDDR, HBM, NAND).
• Vendor tool qualification and software prototyping.
• Agile development practices.
• Machine‑learning algorithms applied to IC design.

What we offer

• Opportunity to work on cutting‑edge memory technologies with a global leader.
• Collaborative environment at Micron’s Guadalajara Design Center.