Failure Analysis Engineer

About the role

The Failure Analysis Engineer will lead investigations into semiconductor IC failures, using advanced electrical and physical analysis techniques to identify root causes. This role collaborates closely with product, design, quality and foundry engineering teams to drive corrective actions and improve device reliability.

Key responsibilities

• Perform failure analyses on complex semiconductor devices, acting as case owner for multiple concurrent issues.
• Utilize electrical fault isolation tools such as static laser techniques, XIVA, OBIRCH, photo emission microscopy, and lock‑in thermal microscopy to locate defects.
• Conduct non‑destructive testing using X‑ray, C‑SAM and optical inspections, and execute advanced physical analyses including mechanical polishing, chemical delayering and SEM inspection.
• Document analysis results, report root causes and provide recommendations to engineering teams.
• Collaborate with cross‑functional, multinational teams to translate findings into corrective actions.

Required profile

• Bachelor’s degree in Science, Engineering or a related field.
• Strong knowledge of semiconductor physics, device operation and wafer fabrication processes.
• Ability to work independently and learn quickly in a fast‑paced environment.

Required skills

• Semiconductor physics
• Circuitry analysis
• Wafer fabrication processes
• Mechanical polishing
• Chemical delayering
• Scanning Electron Microscopy (SEM) inspection
• X‑ray imaging
• C‑SAM imaging
• Static laser fault isolation (XIVA, OBIRCH)
• Photo emission microscopy
• Lock‑in thermal microscopy
• Dynamic laser stimulation
• Thermal and photonic fault injection
• Optical fault isolation and Soft Defect Localization