Failure Analysis Engineer

About the role

The Failure Analysis Engineer will investigate semiconductor IC failures, using both electrical and physical analysis techniques to identify root causes. The role requires close collaboration with product, design, quality and foundry engineering teams to drive corrective actions and improve yield.

Key responsibilities

• Perform failure analyses on complex semiconductor devices, acting as case owner for multiple issues simultaneously.
• Apply advanced electrical fault isolation methods (e.g., XIVA, OBIRCH, photo‑emission microscopy, lock‑in thermal microscopy, dynamic laser stimulation).
• Conduct non‑destructive testing using imaging tools such as X‑ray and C‑SAM, as well as optical inspections.
• Execute physical failure analysis on modules, packages and individual ICs using mechanical polishing, chemical delayering, SEM inspection and other techniques.
• Document analysis results, report root causes and communicate conclusions to requesters.
• Collaborate with cross‑functional, multinational engineering teams to develop corrective actions.

Required profile

• Bachelor’s degree in Science, Engineering or a related field.
• Strong knowledge of semiconductor physics, device operation and wafer fabrication processes.
• Ability to work independently and learn quickly in a fast‑paced environment.
• Excellent collaboration skills for interaction with product, design, quality and foundry teams.

Required skills

• Electrical fault isolation techniques (static laser, dynamic laser, thermal and photonic fault injection).
• Imaging and non‑destructive testing tools: X‑ray, C‑SAM, optical inspection.
• Physical analysis methods: mechanical polishing, chemical delayering, scanning electron microscopy (SEM).
• Optical fault isolation tools: soft defect localization, laser voltage profiling.
• Experience with photo‑emission microscopy, lock‑in thermal microscopy, OBIRCH/TIVA.